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Liquid Spray Impact onto Flat and Rigid Walls: Formation and Spreading of Accumulated Wall Film

Davood Kalantari1, Cameron Tropea2

Dep. of Mechanics of Biosystems Engineering, University of Sari (SANRU), P.O.Box 578, Sari, Iran. Email: dkalantari2000@yahoo.com
Institute of Fluid Mechanics and Aerodynamics, Center of Smart Interfaces, Technische Universität Darmstadt, Darmstadt, Germany.

Fluid Dynamics & Materials Processing 2014, 10(1), 37-61. https://doi.org/10.3970/fdmp.2014.010.037

Abstract

This study presents a combined experimental and theoretical investigation on the formation and spreading of a liquid film on a flat and rigid wall due to spray impact. A dual-mode phase Doppler instrument is used to characterise the spray while the average film thickness is measured using a high-speed CCD camera. The experimental results are complemented with theoretical expressions derived under the assumption that the spray is stationary. A new model for the prediction of the average wall film thickness is formulated taking into account the mean Reynolds number of the impacting drops, the flux density of the impacting droplets, and the average drop diameter. The theoretically determined average film thickness exhibits a good agreement with the measured data when the film can be considered thin.

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APA Style
Kalantari, D., Tropea, C. (2014). Liquid spray impact onto flat and rigid walls: formation and spreading of accumulated wall film. Fluid Dynamics & Materials Processing, 10(1), 37-61. https://doi.org/10.3970/fdmp.2014.010.037
Vancouver Style
Kalantari D, Tropea C. Liquid spray impact onto flat and rigid walls: formation and spreading of accumulated wall film. Fluid Dyn Mater Proc. 2014;10(1):37-61 https://doi.org/10.3970/fdmp.2014.010.037
IEEE Style
D. Kalantari and C. Tropea, "Liquid Spray Impact onto Flat and Rigid Walls: Formation and Spreading of Accumulated Wall Film," Fluid Dyn. Mater. Proc., vol. 10, no. 1, pp. 37-61. 2014. https://doi.org/10.3970/fdmp.2014.010.037



cc Copyright © 2014 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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