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Cooling of electronic components using nanofluids

M. Zitoune1, 2 , O. Ourrad Meziani2, B. Meziani2, M. Adnani1, 2
1 Laboratoire de Mécanique, Matériaux et Energétique, Université de Béjaia, Campus de Targua Ouzemour, Béjaia, 06000 –Algeria. 2 Laboratoire de Physique Théorique, Université A. Mira de Bejaia, Campus de Targua Ouzemour, 06000, Bejaia, Algeria. 1 Corresponding Author: Mounir Zitoune, E-mail: zitoune.mounir@yahoo.fr.

Fluid Dynamics & Materials Processing 2016, 12(1), 33-55. https://doi.org/10.3970/fdmp.2016.012.033

Abstract

A finite volume code used for detailed analysis of forced-convection flow in a horizontal channel containing eight heat sources simulating electronic components. The study deals the effect of variations of Reynolds number, the volume fraction and the good choice of type of nanoparticles added to the base fluid. The study shows that the rate of heat transfer increases with increasing Reynolds number and the volume fraction of nanofluids but not infinitely. The analysis of the dynamic and thermal field shows that the heat transfer is improved, with the increase in the Reynolds number and the volume fraction. The study also shows that the choice of nanoparticles added to the base fluid is crucial, otherwise the best cooling electronic components is observed when using copper nanoparticles followed by those of alumina trioxide.

Keywords

Forced convection, nanofluid, finite volume method, electronic components.

Cite This Article

Zitoune, M., Meziani, O. O., Meziani, B., Adnani, M. (2016). Cooling of electronic components using nanofluids. FDMP-Fluid Dynamics & Materials Processing, 12(1), 33–55.



This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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