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Numerical Investigation of the Thermal Behavior of a System with a Partition Wall Incorporating a Phase Change Material

Nisrine Hanchi*, Hamid Hamza, Jawad Lahjomri, Khalid Zniber, Abdelaziz Oubarra

Faculty of Sciences Ain Chock, Laboratory of Mechanics, Hassan II University of Casablanca, Casablanca, Morocco

* Corresponding Author: Nisrine Hanchi. Email: email

(This article belongs to the Special Issue: Materials and Energy an Updated Image for 2021)

Fluid Dynamics & Materials Processing 2023, 19(5), 1227-1236. https://doi.org/10.32604/fdmp.2023.022530

Abstract

The work deals with the thermal behavior of a conventional partition wall incorporating a phase change material (PCM). The wall separates two environments with different thermal properties. The first one is conditioned, while the adjacent space is characterized by a temperature that changes sinusoidally in time. The effect of the PCM is assessed through a comparative analysis of the cases with and without PCM. The performances are evaluated in terms of dimensionless energy stored within the wall, comfort temperature and variations of these quantities as a function of the amount of PCM and its emplacement.

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APA Style
Hanchi, N., Hamza, H., Lahjomri, J., Zniber, K., Oubarra, A. (2023). Numerical investigation of the thermal behavior of a system with a partition wall incorporating a phase change material. Fluid Dynamics & Materials Processing, 19(5), 1227-1236. https://doi.org/10.32604/fdmp.2023.022530
Vancouver Style
Hanchi N, Hamza H, Lahjomri J, Zniber K, Oubarra A. Numerical investigation of the thermal behavior of a system with a partition wall incorporating a phase change material. Fluid Dyn Mater Proc. 2023;19(5):1227-1236 https://doi.org/10.32604/fdmp.2023.022530
IEEE Style
N. Hanchi, H. Hamza, J. Lahjomri, K. Zniber, and A. Oubarra "Numerical Investigation of the Thermal Behavior of a System with a Partition Wall Incorporating a Phase Change Material," Fluid Dyn. Mater. Proc., vol. 19, no. 5, pp. 1227-1236. 2023. https://doi.org/10.32604/fdmp.2023.022530



cc Copyright © 2023 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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