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Aerothermal Analysis of a Sample-Return Reentry Capsule

V. Carandente1, R. Savino1, M. Iacovazzo1, C. Boffa

1 Department of Aerospace Engineering (DIAS), University of Naples “Federico II”, Naples, Italy

Fluid Dynamics & Materials Processing 2013, 9(4), 461-484. https://doi.org/10.3970/fdmp.2013.009.461

Abstract

The article deals with the aerothermal analysis of a sample-return hypersonic capsule reentering on Earth from an interplanetary exploration mission. The main objective of the work is to estimate the heat flux distribution on the capsule surface and to perform one-dimensional thermal analyses for its ablative heat shield. After a short review of sample-return missions, the numerical models implemented are described and the computational results, obtained along a feasible reentry trajectory, are presented and discussed. Particular attention has been paid to compare the convective stagnation point heat fluxes obtained by means of Computational Fluid Dynamic (CFD) analyses with the ones computed with engineering correlations. A further comparison between CFD and with Direct Simulation Monte Carlo (DSMC), in order to investigate the air rarefaction effects, is reported. The article shows an overall satisfactory agreement between engineering correlation and numerical results and also presents a preliminary dimensioning of the capsule ablative heat shield at the stagnation point.

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APA Style
Carandente, V., Savino, R., Iacovazzo, M., Boffa, C. (2013). Aerothermal analysis of a sample-return reentry capsule. Fluid Dynamics & Materials Processing, 9(4), 461-484. https://doi.org/10.3970/fdmp.2013.009.461
Vancouver Style
Carandente V, Savino R, Iacovazzo M, Boffa C. Aerothermal analysis of a sample-return reentry capsule. Fluid Dyn Mater Proc. 2013;9(4):461-484 https://doi.org/10.3970/fdmp.2013.009.461
IEEE Style
V. Carandente, R. Savino, M. Iacovazzo, and C. Boffa "Aerothermal Analysis of a Sample-Return Reentry Capsule," Fluid Dyn. Mater. Proc., vol. 9, no. 4, pp. 461-484. 2013. https://doi.org/10.3970/fdmp.2013.009.461



cc Copyright © 2013 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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