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ENHANCEMENT OF THERMOELECTRIC DEVICE PERFORMANCE THROUGH INTEGRATED FLOW CHANNELS

B. V. K. Reddy, Matthew Barry, John Li, Minking K. Chyu*

Department of Mechanical Engineering and Materials Science, University of Pittsburgh, Pittsburgh, PA 15261, USA
∗ Leighton Orr Chair Professor and Chairman and Corresponding author, Email: mkchyu@pitt.edu, Ph: 412-624-9720 Fax: 412-624-4846.

Frontiers in Heat and Mass Transfer 2013, 4(2), 1-7. https://doi.org/10.5098/hmt.v4.2.3001

Abstract

In this study, the thermoelectric performance of an integrated thermoelectric device (iTED) with rectangular, round end slots, and circular flow channel designs applied to waste heat recovery for several hot stream flow rates has been investigated using numerical methods. An iTED is constructed with p- and n-type semiconductor materials bonded to the surfaces of an interconnector with flow channels drilled through it. This interconnector acts as an internal heat exchanger directing waste heat from the hot stream to thermoelectric elements. The quantity of heat extracted from the waste heat source and the subsequent amount of electrical power generated P0 from the iTED is increased significantly for the circular flow channels, followed by round end slots and rectangular flow channels, respectively. At Re = 100, the round end slots and the circular flow channels showed nearly 2.6 and 2.9 times increment in P0, and 1.5 and 1.65 times in η when compared to the rectangular flow channels values. Conversely, when Re is increased from 100 to 500, the iTED with rectangular flow channels showed 2.67- and 1.6-fold improvement in P0 and η, respectively. However, the circular configurations showed 2.27- and 1.41-fold increases in P0 and η values, respectively. Within the Re range studied, the inclusion of flow channels’ pumping power in η calculations showed negligible effect. For an iTED with circular flow channels, an increase in a cold side convective heat transfer coefficient hc resulted in an enhancement in P0 and η values. Besides a hc effect, the heat loss to the ambient via convective and radiation heat transfer exhibited an increase in P0 and decrease in η.

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APA Style
Reddy, B.V.K., Barry, M., Li, J., Chyu, M.K. (2013). ENHANCEMENT OF THERMOELECTRIC DEVICE PERFORMANCE THROUGH INTEGRATED FLOW CHANNELS. Frontiers in Heat and Mass Transfer, 4(2), 1-7. https://doi.org/10.5098/hmt.v4.2.3001
Vancouver Style
Reddy BVK, Barry M, Li J, Chyu MK. ENHANCEMENT OF THERMOELECTRIC DEVICE PERFORMANCE THROUGH INTEGRATED FLOW CHANNELS. Front Heat Mass Transf. 2013;4(2):1-7 https://doi.org/10.5098/hmt.v4.2.3001
IEEE Style
B.V.K. Reddy, M. Barry, J. Li, and M.K. Chyu "ENHANCEMENT OF THERMOELECTRIC DEVICE PERFORMANCE THROUGH INTEGRATED FLOW CHANNELS," Front. Heat Mass Transf., vol. 4, no. 2, pp. 1-7. 2013. https://doi.org/10.5098/hmt.v4.2.3001



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