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Implementation of High-Q Embedded Band Pass Filter in Wireless Communication

V. Satheesh Kumar1,*, S. Ramesh2

1 Department of Electronics and Communication Engineering, T. J. S Engineering College, Chennai, Tamil Nadu, 601206, India
2 Valliammai Engineering College, Chennai, Tamil Nadu, 603203, India

* Corresponding Author: V. Satheesh Kumar. Email: email

Intelligent Automation & Soft Computing 2023, 36(2), 2191-2200.


At 12.8 MHz center frequency, the advanced miniaturized polymer-based planar high quality factor (Q) passive elements embedded bandpass filter works in the L-band. Because most of the demands operate inside the spectrum, the wideband or high-speed operation necessary to enhance must be acquired in microwave frequency ranges. The channel has a quiet, high-performance microfilter with wideband rejection. Capacitors and inductors are used in the high quality factor (Q) passive components, and related networks are incorporated in the filter. Embedded layers are concatenated using Three-Dimensional Integrated Circuit (3D-IC) integration, parasitics are removed, and interconnection losses are negotiated using de-embedding methods. A wireless application-based Liquid Crystalline Polymer (LCP) viewpoint is employed as a substrate material in this work. The polymer processes, their properties, and the incorporated high-Q Band Pass Filter Framework. The suggested filter model is computed and manufactured utilizing the L-band frequency spectrum, decreasing total physical length by 31% while increasing bandwidth by 45%.


Cite This Article

APA Style
Kumar, V.S., Ramesh, S. (2023). Implementation of high-q embedded band pass filter in wireless communication. Intelligent Automation & Soft Computing, 36(2), 2191-2200.
Vancouver Style
Kumar VS, Ramesh S. Implementation of high-q embedded band pass filter in wireless communication. Intell Automat Soft Comput . 2023;36(2):2191-2200
IEEE Style
V.S. Kumar and S. Ramesh, "Implementation of High-Q Embedded Band Pass Filter in Wireless Communication," Intell. Automat. Soft Comput. , vol. 36, no. 2, pp. 2191-2200. 2023.

cc This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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