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TSP member serves on SSP’s DEIA Committee
Journal Publication Frequency Changes in 2023
Dr. Kun Zhou named Co-Editor-in-Chief of Computer Modeling in Engineering & Sciences
IASC 2022 Best Reviewer Award
Frontiers in Heat and Mass Transfer Achieves First Impact Factor of 1.8
Sound & Vibration Got the Impact Factor for the First Time in 2023
STATEMENT ABOUT CYBERSECURITY
Congratulations to JRM, CMES & EE: Become Members of COPE
Congratulations to CMC & BIOCELL: Become Members of COPE
JRM Most Cited Paper Award 2021
JRM Outstanding Reviewer Award 2021
Prof. Zhen Fang, Associate Editor of Journal of Renewable Materials, elected into the Canadian Academy...
CMES: 2020 Editor Award, 2020 Reviewer Award and 2020 Guest Editor Award
Winners of 2020 CMES Young Researcher Award Announced
Call for Papers! Meet us at ICCES2022, DUBAI, UAE, 8-12, JANUARY
New Submission System Launched
Prof. Hai Jin named the Co-Editor-in-Chief of Computer Systems Science and Engineering (CSSE)
New Submission System Online Announcement
Prof. Zhi-Yong Li named the Co-Editor-in-Chief of Molecular & Cellular Biomechanics (MCB)
Tech Science Press joins SSP, ALPSP and CSE
Dr. Xingming Sun named the Co-Editor-in-Chief of Intelligent Automation & Soft Computing (IASC)
JRM welcomes its first Editor-in-Chief Prof. Antonio Pizzi
Prof. Wenming Yang named the Editor-in-Chief of Energy Engineering.
Prof. Zhe Chen named the Editor-in-Chief of Energy Engineering.
Inaugural CMES Young Researcher Award
Dr. Guoren Wang named the Editor-in-Chief of Computers, Materials & Continua.