Naveen G. Patil, Tapano Kumar Hotta*
Frontiers in Heat and Mass Transfer, Vol.11, pp. 1-13, 2018, DOI:10.5098/hmt.11.16
Abstract The manuscript deals with the critical review for cooling of discrete heated electronic components using liquid jet impingement. Cooling of electronic
components has been a lead area of research in recent years. Due to the rapid growth of electronic industries, there is an enormous rise in the system
power consumption, and the reduction in the size of electronic components has led to a rapid increase in the heat dissipation rate per unit volume of
components. The present paper deals with the role of liquid jet impingement (heat flux removal rate 200 - 600 W/cm2) for cooling of electronic
components. The… More >
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