Mohammed Yunus*, Mohammad S. Alsoufi
Frontiers in Heat and Mass Transfer, Vol.12, pp. 1-8, 2019, DOI:10.5098/hmt.12.11
Abstract Swift cooling systems, improved microprocessor chips, processors’ performance and power usage have increased production of an enormous amount
of heat and high operating temperatures due to excess heat flux density in the field of microelectronics. A rapid cooling of electronic circuits and heat
dissipation for the same size of pipe with the present technology as nano size circuits critically generate high heat flux beyond 100 W/cm2 is currently
the challenging task with which we are presented. Cooling in the form of heat transfer should be managed using both thermal conductivity (evaporation)
and phase transition (condensation) between the two solid interfaces… More >
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