Masataka Mochizukia,*,†, Thang Nguyenb
Frontiers in Heat and Mass Transfer, Vol.13, pp. 1-6, 2019, DOI:10.5098/hmt.13.12
Abstract The cooling device for computers and electronics is getting smaller and thinner year after year, especially for the mobile handheld device such as
smartphone which is the most popular gadget and widely use nowadays. It seems that in the current trend every 6-12 months a new model of
smartphone is introduced and it was packed with faster processing processor, memories, and graphics, higher density battery, higher resolution for
camera and video and so on. The drawback is the device getting hotter due to the increase of heat dissipation caused by faster computing. The
traditional method of cooling by purely metal… More >
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