C. B. SobhanaG. P. Petersonb,*
Frontiers in Heat and Mass Transfer, Vol.13, pp. 1-10, 2019, DOI:10.5098/hmt.13.5
Abstract Micro heat pipes have found applications in numerous types of systems where effective heat dissipation in a limited space is required. One relatively
new design/fabrication methodology for parallel micro heat pipes with high performance is referred to as “wire-bonded” micro heat pipe arrays. The
following review analyzes the principles of operation of these devices and investigates the recent developments in the technology, along with their
fabrication and application. The results indicate that these micro heat pipe arrays present an attractive alternative for a number of interesting applications,
including many that have yet to be explored. More >
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