E.Y.K. Ng1, S.T. Poh 2
CMES-Computer Modeling in Engineering & Sciences, Vol.3, No.3, pp. 351-366, 2002, DOI:10.3970/cmes.2002.003.351
Abstract Advances in microfabrication technology have allowed the use of microchannels in ultra compact, very efficient heat exchangers, which capitalize on the channels large surface area to volume ratio, to transport high heat fluxes with small thermal resistances. One example is the cooling of microchips. However, research into microscale flow and heat transfer phenomena conducted by various researchers provided substantial experimental data and considerable evidence that the behaviour of fluid flow and heat transfer in microchannels without phase change may be different than that which normally occurs in larger more conventional sized channels.
This paper describes a numerical analysis with… More >
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