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    Electromechanical Impedance Method for the Health Monitoring of Bonded Joints: Numerical Modelling and Experimental Validation

    Vincenzo Gulizzi1,2, Piervincenzo Rizzo2,3, Alberto Milazzo4

    Structural Durability & Health Monitoring, Vol.10, No.1, pp. 19-54, 2014, DOI:10.3970/sdhm.2014.010.019

    Abstract The electromechanical impedance (EMI) method is one of the many nondestructive evaluation approaches proposed for the health monitoring of aerospace, civil, and mechanical structures. The method consists of attaching or embedding one or more wafer-type piezoelectric transducers (PZTs) to the system of interest, the host structure, and measuring certain electrical characteristics of the transducers. As these characteristics are also related to the impedance of the host structure, they can be used to infer the mechanical properties of the monitored structure. In the study presented in this paper, we utilize the EMI to monitor the quality of adhesively bonded joints. A… More >

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