Peter Kastena, Severin Zimmermanna, Manish K. Tiwaria, Bruno Michelb, Dimos Poulikakosa,*
Frontiers in Heat and Mass Transfer, Vol.1, No.2, pp. 1-10, 2010, DOI:10.5098/hmt.v1.2.3006
Abstract Electronic data center cooling using hot water is proposed for high system exergetic utility. The proof-of-principle is provided by numerically
modeling a manifold micro-channel heat sink for cooling microprocessors of a data center. An easily achievable 0.5l/min per chip water flow, with
60°C inlet water temperature, is found sufficient to address the typical data center thermal loads. A maximum temperature difference of ~8°C was
found between the solid and liquid, confirming small exergetic destruction due to heat transport across a temperature differential. The high water
outlet temperature from the heat sink opens the possibility of waste heat recovery applications. More >
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