X. Wang1, W.T. Ang1,2, H. Fan1
CMES-Computer Modeling in Engineering & Sciences, Vol.107, No.2, pp. 81-101, 2015, DOI:10.3970/cmes.2015.107.081
Abstract A micromechanical model is proposed here for estimating the effective stiffness of a pair of parallel microscopically damaged interfaces in a trimaterial under inplane elastostatic deformations. The trimaterial is made of an orthotropic thin layer sandwiched between two orthotropic half-spaces. The microscopically damaged interfaces are modeled using periodically distributed interfacial micro-cracks. The micromechanical model is formulated and numerically solved in terms of hypersingular boundary integro-differential equations. The effects of the width of the thin layer, the micro-crack densities of the two interfaces and the material constants of the thin layer and the two half-spaces on the effective stiffness coefficients are… More >
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