A. M. Dongare1,2, A. M. Rajendran3, B. LaMattina4, M. A. Zikry1, D. W. Brenner1
CMC-Computers, Materials & Continua, Vol.24, No.1, pp. 43-60, 2011, DOI:10.3970/cmc.2011.024.043
Abstract Large-scale molecular dynamics (MD) simulations are used to investigate the effects of microstructure and loading conditions on the dynamic failure behavior of nanocrystalline Cu. The nucleation, growth, and coalescence of voids is investigated for the nanocrystalline metal with average grain sizes ranging from 6 nm to 12 nm (inverse Hall-Petch regime) for conditions of uniaxial expansion at constant strain rates ranging from 4x107 s - 1 to 1010 s - 1. MD simulations suggest that the evolution of voids can be described in two stages: The first stage corresponds to the nucleation of voids and the fast linear initial growth… More >
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