Kuan-Ting Liu1, Chun-Lin Lu1, Nyan-Hwa Tai2, Meng-Kao Yeh1, *
CMES-Computer Modeling in Engineering & Sciences, Vol.122, No.2, pp. 661-674, 2020, DOI:10.32604/cmes.2020.07792
Abstract In this study, the deformation and stress distribution of printed circuit board
(PCB) with different thickness and composite materials under a shock loading were
analyzed by the finite element analysis. The standard 8-layer PCB subjected to a shock
loading 1500 g was evaluated first. Moreover, the finite element models of the PCB with
different thickness by stacking various number of layers were discussed. In addition to
changing thickness, the core material of PCB was replaced from woven E-glass/epoxy to
woven carbon fiber/epoxy for structural enhancement. The non-linear material property
of copper foil was considered in the analysis. The results indicated… More >
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