D. S. Liu1, C.Y. Tsai1
CMES-Computer Modeling in Engineering & Sciences, Vol.39, No.1, pp. 29-48, 2009, DOI:10.3970/cmes.2009.039.029
Abstract Utilizing a thin copper substrate for illustration purposes, this study presents a novel numerical method for extracting the thermo-mechanical properties of a thin-film. In the proposed approach, molecular dynamics (MD) simulations are performed to establish the load-displacement response of a thin copper substrate nanoindented at temperatures ranging from 300~1400 K. The load data are then input to an artificial neural network (ANN), trained using a finite element model (FEM), in order to extract the material constants of the copper substrate. The material constants are then used to construct the corresponding stress-strain curve, from which the elastic modulus and the plastic… More >
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