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    ARTICLE

    Development of 3D Trefftz Voronoi Cells with Ellipsoidal Voids &/or Elastic/Rigid Inclusions for Micromechanical Modeling of Heterogeneous Materials

    Leiting Dong1, Satya N. Atluri11

    CMC-Computers, Materials & Continua, Vol.30, No.1, pp. 39-82, 2012, DOI:10.3970/cmc.2012.030.039

    Abstract In this paper, as an extension to the authors's work in [Dong and Atluri (2011a,b, 2012a,b,c)], three-dimensional Trefftz Voronoi Cells (TVCs) with ellipsoidal voids/inclusions are developed for micromechanical modeling of heterogeneous materials. Several types of TVCs are developed, depending on the types of heterogeneity in each Voronoi Cell(VC). Each TVC can include alternatively an ellipsoidal void, an ellipsoidal elastic inclusion, or an ellipsoidal rigid inclusion. In all of these cases, an inter-VC compatible displacement field is assumed at each surface of the polyhedral VC, with Barycentric coordinates as nodal shape functions. The Trefftz trial displacement fields in each VC are… More >

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