Masataka Mochizuki^a,*,†, Thang Nguyen^b

Frontiers in Heat and Mass Transfer, Vol.13, pp. 1-6, 2019, DOI:10.5098/hmt.13.12

Abstract The cooling device for computers and electronics is getting smaller and thinner year after year, especially for the mobile handheld device such as smartphone which is the most popular gadget and widely use nowadays. It seems that in the current trend every 6-12 months a new model of smartphone is introduced and it was packed with faster processing processor, memories, and graphics, higher density battery, higher resolution for camera and video and so on. The drawback is the device getting hotter due to the increase of heat dissipation caused by faster computing. The traditional method of cooling by purely metal… More >

Yasushi Koito^*

Frontiers in Heat and Mass Transfer, Vol.16, pp. 1-6, 2021, DOI:10.5098/hmt.16.8

Abstract Numerical analyses were conducted for an ultra-thin heat pipe in which a thin wick layer was placed on the bottom. The vapor temperature drop caused by vapor flow friction was discussed for two types of the ultra-thin heat pipes with small and large widths. The numerical results were compared with those obtained for an ultra-thin heat pipe with a centered-wick structure. It was confirmed that the vapor temperature drop was reduced effectively by increasing the width of the heat pipe. Therefore, a wider ultra-thin heat pipe, that is, an ultra-thin vapor chamber is a promising option for nextgeneration thermal management. More >