Ki-Yeol Eom1, Byungseok Min2,*
CMC-Computers, Materials & Continua, Vol.75, No.3, pp. 6337-6350, 2023, DOI:10.32604/cmc.2023.035336
Abstract Automated X-ray defect inspection of occluded objects has been an essential topic in semiconductors, autonomous vehicles, and artificial intelligence devices. However, there are few solutions to segment occluded objects in the X-ray inspection efficiently. In particular, in the Ball Grid Array inspection of X-ray images, it is difficult to accurately segment the regions of occluded solder balls and detect defects inside solder balls. In this paper, we present a novel automatic inspection algorithm that segments solder balls, and detects defects fast and efficiently when solder balls are occluded. The proposed algorithm consists of two stages. In the first stage, the… More >
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