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  • Open Access

    ARTICLE

    Curing Kinetics of Tannin and Lignin Biobased Adhesives Determined by DSC and ABES

    Jaša Saražin1, Ida Poljanšek1, Antonio Pizzi2, Milan Šernek1,*

    Journal of Renewable Materials, Vol.10, No.8, pp. 2117-2131, 2022, DOI:10.32604/jrm.2022.019602

    Abstract The curing process of two biobased adhesives: pine tanninhexamine (TH) and organosolv lignin non-isocyanate polyurethane (NIPU), suitable for interior nonstructural use, were compared with commercial urea-formaldehyde (UF) adhesive. Changes in chemical structure before and after the curing process were observed with Fouriertransform infrared spectroscopy (FTIR). The process of adhesive curing was monitored with differential scanning calorimetry (DSC) and the automated bonding evaluation system (ABES). Both DSC and ABES measurements confirmed UF as the fastest and NIPU as the slowest curing adhesive observed. Taking into account the ABES results, the optimal pressing parameters for the TH adhesive would be 4 min… More >

  • Open Access

    ARTICLE

    Synthetic Process of Bio-Based Phenol Formaldehyde Adhesive Derived from Demethylated Wheat Straw Alkali Lignin and Its Curing Behavior

    Yan Song1,2, Zhixin Wang3, Xin Zhang4, Rong Zhang1, Jinchun Li1,2,*

    Journal of Renewable Materials, Vol.9, No.5, pp. 943-957, 2021, DOI:10.32604/jrm.2021.014131

    Abstract Lignin is a natural biopolymer with a complex three-dimensional network, commercially obtained from waste liquid of paper pulp and bioethanol production, and could be a candidate for preparation of environment-friendly bio-based polyphenol material. In the present work, the demethylated wheat straw alkali lignin (D-Lig), prepared by demethylation of wheat straw alkali lignin (Lig) using an in-situ generated Lewis acid, was used to synthesize bio-based phenol formaldehyde resin adhesive (D-LPF) applied in plywood. Effects of synthetic process’s factors, including lignin substitution for phenol, NaOH concentration and molar ratio of formaldehyde to phenol, on the bonding strength and free formaldehyde content of… More >

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