L. Krambeck1, G. A. Bartmeyer1, D. O. Souza2, D. Fusão1, P. H. D. Santos2, T. Antonini Alves1,*
Energy Engineering, Vol.118, No.1, pp. 1-14, 2021, DOI:10.32604/EE.2020.013572
Abstract The temperature control in electronic packaging is the key in numerous applications, to avoid overheating and hardware failure. Due to high capability of heat transfer, good temperature uniformity, and no power consumption, heat pipes can be widely used for heat dissipation of electronic components. This paper reports an experimental thermal analysis of different capillary structures for heat pipes. The wicks considered are metal screens, axial microgrooves, and sintered metal powder. The heat pipes are made of copper, a 200 mm length tube and a 9.45 mm external diameter. Working fluid used was distilled water. The devices are investigated in three… More >
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