R. Praveena¹, S. Nirmala²

CMC-Computers, Materials & Continua, Vol.53, No.1, pp. 37-47, 2017, DOI:10.3970/cmc.2017.053.039

Abstract DSP operation in a Biomedical related therapeutic hardware need to be performed with high accuracy and with high speed. Portable DSP hardware’s like pulse/heart beat detectors must perform with reduced operational power due to lack of conventional power sources. This work proposes a hybrid biomedical hardware chip in which the speed and power utilization factors are greatly improved. Multipliers are the core operational unit of any DSP SoC. This work proposes a LUT based unsigned multiplication which is proven to be efficient in terms of high operating speed. For n bit input multiplication n*n memory array of 2n bit size… More >

M. Chang^1,2,3, Y. C. Chou^1,2, P. T. Lin^1,2, J. L. Gabayno^2,4

CMC-Computers, Materials & Continua, Vol.42, No.2, pp. 125-140, 2014, DOI:10.3970/cmc.2014.042.125

Abstract Automated optical inspection systems installed in production lines help ensure high throughput by speeding up inspection of defects that are otherwise difficult to detect using the naked eye. However, depending on the size and surface properties of the products such as micro-cracks on touchscreen panels glass cover, the detection speed and accuracy are limited by the imaging module and lighting technique. Therefore the current inspection methods are still delegated to a few qualified personnel whose limited capacity has been a huge tradeoff for high volume production. In this study, an automated optical technology for in-line surface defect inspection is developed… More >

Linsen Zhu¹, Jiang Zhou², Xuejun Fan²

CMC-Computers, Materials & Continua, Vol.39, No.2, pp. 113-134, 2014, DOI:10.3970/cmc.2014.039.113

Abstract In this paper, a damage mechanics-based continuum theory is developed for the coupled analysis of moisture vaporization, moisture absorption and desorption, heat conduction, and mechanical stress for a reflow process in microelectronic devices. The extremely compliant film has been used in wafer level lamination process. Such a soft film experiences cohesive rupture subjected to moisture absorption during reflow. The numerical simulation results have demonstrated that vapor pressure due to moisture vaporization is the dominant driving force for the failures. The correlation between the vapor pressure evolution and the film rupture observed from the experiments have been established through two case… More >

Richard K. F. Lee¹, James M. Hill²

CMC-Computers, Materials & Continua, Vol.20, No.1, pp. 85-100, 2010, DOI:10.3970/cmc.2010.020.085

Abstract In this study, we investigate the mechanics of a metallofullerene shuttle memory device, comprising a metallofullerene which is located inside a closed carbon nanotube. The interaction energy for the system is obtained from the 6-12 Lennard-Jones potential using the continuum approximation, which assumes that a discrete atomic structure can be replaced by an average atomic surface density. This approach shows that the system has two equal minimum energy positions, which are symmetrically located close to the tube extremities, and therefore it gives rise to the possibility of being used as a two-state memory device. On one side the encapsulated metallofullerene… More >