Yasushi Koito^1,*, Shoma Hitotsuya², Takamitsu Takayama², Kenta Hashimoto²

Frontiers in Heat and Mass Transfer, Vol.21, pp. 33-46, 2023, DOI:10.32604/fhmt.2023.041829

Abstract An ultra-thin flattened heat pipe has been developed with a centered wick structure. This structure is essential to make the heat pipe thinner. However, the centered wick structure reduces the evaporation and condensation surface areas of the wick structure because it is sandwiched between heat pipe walls. In this study, because detailed discussion has not been made, heat transfer experiments were conducted for the wick structure sandwiched between two solid walls. This study focused on the evaporation heat transfer characteristics from the sandwiched wick structure. The experiments were conducted with three wick structures, that is, strip-shaped sintered copper powders with… More >

M.D. Alam, O.T. Popoola, Y. Cao^*

Frontiers in Heat and Mass Transfer, Vol.13, pp. 1-16, 2019, DOI:10.5098/hmt.13.17

Abstract The significant increase in the heat dissipation associated with the increased throughput in computing, renewable energy, and electric vehicles has become a limitation to the evolution of these technologies. The needs for more effective thermal-management methods for higher heat fluxes and more uniform temperature have resulted in the development of mechanically driven oscillating flow cooling systems. The objective of this paper is to review the state-of-the-art of mechanically driven oscillating flow loops (MDOFLs) in terms of several aspects such as heat transfer, fluid mechanics, and thermodynamic principles. In each aspect, essential formulas and related sciences from prior studies are presented… More >

Roshan Devidas Bhagat^a,*, Samir J. Deshmukh^b

Frontiers in Heat and Mass Transfer, Vol.16, pp. 1-16, 2021, DOI:10.5098/hmt.16.23

Abstract Numerical analysis of passive two phase fluid flow in a 3D Closed Loop Pulsating Heat Pipe (CLPHP) with turns in evaporator and condenser section is carried out. Water is used as working fluid. The volume of fluid model (VOF) is used to simulate passive two-phase fluid flow in a Closed Loop Pulsating Heat Pipe. Filling ratio (FR) of is kept in the range of 60 to 70%. The evaporator temperature is set in the range of 353 K. The condenser temperature is set in the range of 298 K. The contours of volume fraction water, wall temperature and contours of… More >

Brahim Amahan¹, Hamid El Qarnia^2,*, Ali El Afif¹

FDMP-Fluid Dynamics & Materials Processing, Vol.18, No.5, pp. 1539-1549, 2022, DOI:10.32604/fdmp.2022.021839

Abstract This paper numerically investigates the effect of the location of a horizontal fin on the melting of a phase change material (PCM) inside a rectangular enclosure heated by multiple discrete pulsed protruding heat sources. The fin and the phase change material filling the enclosure store the thermal energy extracted from the heat sources, in sensible and latent forms. The heat sources are assumed to simulate electronic components undergoing a superheating technical issue. By extracting heat from the electronics, the PCM plays the role of a heat sink. To analyze the thermal behavior and predict the cooling performance of the proposed… More >

Ziad Saghir, Cayley Delisle, Christopher Welsford^*

The International Conference on Computational & Experimental Engineering and Sciences, Vol.21, No.1, pp. 19-19, 2019, DOI:10.32604/icces.2019.05145

Abstract The enhancement of consumer and industrial electronics has led to an increase in both the power and compactness of the products available. However, with these increases follows a subsequent increase in the thermal losses experienced across, for example, a central processing unit (CPU). As well, the need to dissipate waste thermal energy is compounded by the increased compactness. As the chipsets become smaller, the threads contained therein also reduce in size and as such become more sensitive to temperature gradients which can cause deformation. Although this deformation is miniscule, its continuous repetition can ultimately result in a thermally induced fatigue… More >