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  • Open Access



    M.D. Alam, O.T. Popoola, Y. Cao*

    Frontiers in Heat and Mass Transfer, Vol.13, pp. 1-16, 2019, DOI:10.5098/hmt.13.17

    Abstract The significant increase in the heat dissipation associated with the increased throughput in computing, renewable energy, and electric vehicles has become a limitation to the evolution of these technologies. The needs for more effective thermal-management methods for higher heat fluxes and more uniform temperature have resulted in the development of mechanically driven oscillating flow cooling systems. The objective of this paper is to review the state-of-the-art of mechanically driven oscillating flow loops (MDOFLs) in terms of several aspects such as heat transfer, fluid mechanics, and thermodynamic principles. In each aspect, essential formulas and related sciences from prior studies are presented… More >

  • Open Access



    Roshan Devidas Bhagata,*, Samir J. Deshmukhb

    Frontiers in Heat and Mass Transfer, Vol.16, pp. 1-16, 2021, DOI:10.5098/hmt.16.23

    Abstract Numerical analysis of passive two phase fluid flow in a 3D Closed Loop Pulsating Heat Pipe (CLPHP) with turns in evaporator and condenser section is carried out. Water is used as working fluid. The volume of fluid model (VOF) is used to simulate passive two-phase fluid flow in a Closed Loop Pulsating Heat Pipe. Filling ratio (FR) of is kept in the range of 60 to 70%. The evaporator temperature is set in the range of 353 K. The condenser temperature is set in the range of 298 K. The contours of volume fraction water, wall temperature and contours of… More >

  • Open Access


    Thermal Analysis of Melting Occurring Inside a Finned Rectangular Enclosure Equipped with Discrete Pulsed Protruding Heat Sources

    Brahim Amahan1, Hamid El Qarnia2,*, Ali El Afif1

    FDMP-Fluid Dynamics & Materials Processing, Vol.18, No.5, pp. 1539-1549, 2022, DOI:10.32604/fdmp.2022.021839

    Abstract This paper numerically investigates the effect of the location of a horizontal fin on the melting of a phase change material (PCM) inside a rectangular enclosure heated by multiple discrete pulsed protruding heat sources. The fin and the phase change material filling the enclosure store the thermal energy extracted from the heat sources, in sensible and latent forms. The heat sources are assumed to simulate electronic components undergoing a superheating technical issue. By extracting heat from the electronics, the PCM plays the role of a heat sink. To analyze the thermal behavior and predict the cooling performance of the proposed… More >

  • Open Access


    Analysis on the Thermal Performance of Nanofluids As Working Fluid With Porous Heat Sinks: Applications in Electronics Cooling

    Ziad Saghir, Cayley Delisle, Christopher Welsford*

    The International Conference on Computational & Experimental Engineering and Sciences, Vol.21, No.1, pp. 19-19, 2019, DOI:10.32604/icces.2019.05145

    Abstract The enhancement of consumer and industrial electronics has led to an increase in both the power and compactness of the products available. However, with these increases follows a subsequent increase in the thermal losses experienced across, for example, a central processing unit (CPU). As well, the need to dissipate waste thermal energy is compounded by the increased compactness. As the chipsets become smaller, the threads contained therein also reduce in size and as such become more sensitive to temperature gradients which can cause deformation. Although this deformation is miniscule, its continuous repetition can ultimately result in a thermally induced fatigue… More >

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