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    Wrinkling Analysis in a Film Bonded to a Compressible Compliant Substrate in Large Deformation

    Zhicheng Ou1, Xiaohu Yao1, Xiaoqing Zhang1,2, Xuejun Fan3

    CMC-Computers, Materials & Continua, Vol.44, No.3, pp. 205-222, 2014, DOI:10.3970/cmc.2014.044.205

    Abstract The buckling of a thin film on a compressible compliant substrate in large deformation is studied. A finite-deformation theory is developed to model the film and the substrate under different original strain-free configurations. The neo-Hookean constitutive relation is applied to describe the substrate. Through the perturbation analysis, the analytical solution for this highly nonlinear system is obtained. The buckling wave number, amplitude and critical condition are obtained. Comparing with the traditional linear model, the buckling amplitude decreases. The wave number increases and relates to the prestrain. With the increment of Poisson’s ratio of the substrate, the buckling wave number increases,… More >

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