N. Miyazaki1, T. Tamura2, K. Yamamoto1
CMES-Computer Modeling in Engineering & Sciences, Vol.1, No.1, pp. 99-106, 2000, DOI:10.3970/cmes.2000.001.099
Abstract Quantitative estimation of the failure of a gadolinium orthosilicate (Gd2SiO5, hereafter abbreviated as GSO) single crystal induced by thermal stress was investigated. A GSO cylindrical test specimen was heated in a silicone oil bath, then subjected to large thermal stress by room temperature silicone oil. Cracking occurred during cooling. The transient heat conduction analysis was performed to obtain temperature distribution in the test specimen at the time of cracking, using the surface temperatures measured in the test. Then the thermal stress was calculated using the temperature profile of the test specimen obtained from the heat conduction analysis. It is found… More >
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