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  • Open Access

    ARTICLE

    Study of the Underfill Effect on the Thermal Fatigue Life of WLCSP-Experiments and Finite Element Simulations

    Shaw-Jyh Shin1, Chen-Hung Huang2, Y.C. Shiah3

    CMES-Computer Modeling in Engineering & Sciences, Vol.40, No.1, pp. 83-104, 2009, DOI:10.3970/cmes.2009.040.083

    Abstract Owing to the CTE (Coefficient of Thermal Expansion) mismatch among solder joints, IC (Integrated Circuit) chip, and PCB (Printed Circuit Board), electronic packages shall experience fatigue failure after going though a period of thermal cycling. As a major means to enhance the reliability of the solder joints, underfill is often dispensed to fill the gap between the die and the substrate. This study aims at investigating how the underfill may affect the thermal fatigue life of WLCSP (Wafer Level Chip Scale Package) by means of FEA (finite element analysis). In this study, the thermal fatigue More >

  • Open Access

    ARTICLE

    Finite Element Simulations of Four-holes Indirect Extrusion Processes of Seamless Tube

    Dyi-Cheng1, Syuan-Yi Syong1

    CMC-Computers, Materials & Continua, Vol.13, No.3, pp. 191-200, 2009, DOI:10.3970/cmc.2009.013.191

    Abstract Finite element simulations are performed to investigate the plastic deformation behavior of Ti-6Al-4V titanium alloy during its indirect extrusion through a four-hole die. The simulations assume the die, mandrel and container to be rigid bodies and ignore the temperature change induced during the extrusion process. Under various extrusion conditions, the present numerical analysis investigates the effective stress and profile of product at the exit. The relative influences of the friction factors, the temperature of billet and the eccentricity of four-hole displacement are systematically examined. The simulations focus specifically on the effects of the friction factor, More >

  • Open Access

    ARTICLE

    Assessment of Mixed Uniform Boundary Conditions for Predicting the Mechanical Behavior of Elastic and Inelastic Discontinuously Reinforced Composites

    D. H. Pahr1, H.J. Böhm1

    CMES-Computer Modeling in Engineering & Sciences, Vol.34, No.2, pp. 117-136, 2008, DOI:10.3970/cmes.2008.034.117

    Abstract The combination of heterogeneous volume elements and numerical analysis schemes such as the Finite Element method provides a powerful and well proven tool for studying the mechanical behavior of composite materials. Periodicity boundary conditions (PBC), homogeneous displacement boundary conditions (KUBC) and homogeneous traction boundary conditions (SUBC) have been widely used in such studies. Recently Pahr and Zysset (2008) proposed a special set of mixed uniform boundary conditions (MUBC) for evaluating the macroscopic elasticity tensor of human trabecular bone. These boundary conditions are not restricted to periodic phase geometries, but were found to give the same… More >

  • Open Access

    ABSTRACT

    Moving Finite Element Simulation of Various Fracture Path Prediction in Materials Containing Holes and Inclusions

    Nishioka T.1, sugami M.1, Fujimoto T.1

    The International Conference on Computational & Experimental Engineering and Sciences, Vol.1, No.3, pp. 119-126, 2007, DOI:10.3970/icces.2007.001.119

    Abstract In this paper, the simulations of fatigue crack propagation and dynamic fracture path prediction are carried out for specimens containing circular holes or inclusions, using the moving finite element method based on Delaunay automatic triangulation. And, we compared the numerical results with the experimental results. More >

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