Zihuan Ma1, Xiang Ma1, Chengyu Hu1, Jinjia Wei1,2,*
The International Conference on Computational & Experimental Engineering and Sciences, Vol.26, No.2, pp. 1-1, 2023, DOI:10.32604/icces.2023.08963
Abstract Flow boiling in microchannel heat sinks is considered as a promising cooling solution for electronic
components. Higher heat flux can be effectively dissipated by the utilization of the latent heat of
vaporization. However, most of the current studies on flow boiling in microchannels are mainly
experimental investigations and two-dimensional numerical studies. In this paper, the Volume of Fluid
(VOF) model combined with the Lee evaporation-condensation phase change model is used to simulate the
flow boiling of HFE7100 in horizontal microchannels by three-dimensional conjugate numerical simulation.
The numerical simulation results are compared with the experimental results [1], showing an excellent
agreement.… More >
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