Toru Ikeda1, Isao Arase, Yuya Ueno, Noriyuki Miyazaki
CMES-Computer Modeling in Engineering & Sciences, Vol.1, No.1, pp. 91-98, 2000, DOI:10.3970/cmes.2000.001.091
Abstract In electronic devices, the corners of joined dissimilar materials exist between plastic resin and a die pad or a chip. Failure of the plastic resin is often caused from these corners during the assembly process or the operation of products. The strength evaluation of the corner is important to protect the failure of plastic packages. To evaluate the singular stress field around a corner, we utilize the stress intensity factors of the asymptotic solution for a corner of joined dissimilar materials. We show that the accurate stress intensity factor can be analyzed by the displacement extrapolation method using the displacement… More >
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