Daoming Wei¹, Fangyan Ge², Bopeng Zhang¹, Zhiqiang Zhao³, Dequan Li^3,*, Lizong Xi⁴, Jinrong Hu^5,*, Xin Wang⁶

CMC-Computers, Materials & Continua, Vol.83, No.3, pp. 5729-5746, 2025, DOI:10.32604/cmc.2025.061402 - 19 May 2025

Abstract Accurate cloud classification plays a crucial role in aviation safety, climate monitoring, and localized weather forecasting. Current research has been focusing on machine learning techniques, particularly deep learning based model, for the types identification. However, traditional approaches such as convolutional neural networks (CNNs) encounter difficulties in capturing global contextual information. In addition, they are computationally expensive, which restricts their usability in resource-limited environments. To tackle these issues, we present the Cloud Vision Transformer (CloudViT), a lightweight model that integrates CNNs with Transformers. The integration enables an effective balance between local and global feature extraction. To… More >

Li Li^*, Qing Zhang, Youran Kong

CMC-Computers, Materials & Continua, Vol.80, No.1, pp. 801-818, 2024, DOI:10.32604/cmc.2024.051916 - 18 July 2024

Abstract Due to the diversity and unpredictability of changes in malicious code, studying the traceability of variant families remains challenging. In this paper, we propose a GAN-EfficientNetV2-based method for tracing families of malicious code variants. This method leverages the similarity in layouts and textures between images of malicious code variants from the same source and their original family of malicious code images. The method includes a lightweight classifier and a simulator. The classifier utilizes the enhanced EfficientNetV2 to categorize malicious code images and can be easily deployed on mobile, embedded, and other devices. The simulator utilizes… More >

Meng Huang, Honglei Wei^*, Xianyi Zhai

CMC-Computers, Materials & Continua, Vol.79, No.1, pp. 531-547, 2024, DOI:10.32604/cmc.2024.048510 - 25 April 2024

Abstract In pursuit of cost-effective manufacturing, enterprises are increasingly adopting the practice of utilizing recycled semiconductor chips. To ensure consistent chip orientation during packaging, a circular marker on the front side is employed for pin alignment following successful functional testing. However, recycled chips often exhibit substantial surface wear, and the identification of the relatively small marker proves challenging. Moreover, the complexity of generic target detection algorithms hampers seamless deployment. Addressing these issues, this paper introduces a lightweight YOLOv8s-based network tailored for detecting markings on recycled chips, termed Van-YOLOv8. Initially, to alleviate the influence of diminutive, low-resolution… More >