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  • Open Access


    Comparison of Thermal Performance for Two Types of ETFP System under Various Operation Schemes

    Lingtong Li1, Zaiguo Fu1, *, Benxiang Li2, Qunzhi Zhu1

    CMES-Computer Modeling in Engineering & Sciences, Vol.124, No.1, pp. 23-44, 2020, DOI:10.32604/cmes.2020.09299

    Abstract The earth to fluid pipe (ETFP) system has been widely applied to various energy engineering. The numerical model of the heat transfer process in the ETFP system with a shallow-buried horizontal or a deep-buried vertical U-shape pipe adopted in practical engineering was established and the model distinctions were pointed out. The comparison of the thermal performance between the two types of ETFP system under various schemes was conducted on the basis of numerical prediction. The results showed that the thermal parameters of the ETFP system with a shallow-buried horizontal pipe were influenced by the inlet velocity and ground temperature obviously.… More >

  • Open Access

    Cardboard-Based Packaging Materials as Renewable Thermal Insulation of Buildings: Thermal and Life-Cycle Performance

    M. Čekon*, K. Struhala, R. Slávik

    Journal of Renewable Materials, Vol.5, Suppl.1, pp. 84-93, 2017, DOI:10.7569/JRM.2017.634135

    Abstract Cardboard-based packaging components represent a material that has significant potential as a renewable source for exploitation in buildings. This study presents the results of thermal and environmental analyses of existing packaging materials compared with standard conventional thermal insulations.
    Experimental measurements were performed to identify the thermal performance of studied cardboard packaging materials. Real-size samples were experimentally tested in laboratory measurements. The thermal resistance and conductivity of all the analyzed samples were measured according to the procedure indicated in the ISO8032 standard. A life-cycle assessment according to ISO 14040 was also performed to evaluate the environmental impacts related to the… More >

  • Open Access


    A Numerical Investigation of the Thermal Performances of an Array of Heat Pipes for Battery Thermal Management

    Chaoyi Wan1, *

    FDMP-Fluid Dynamics & Materials Processing, Vol.15, No.4, pp. 343-356, 2019, DOI:10.32604/fdmp.2019.07812

    Abstract A comparative numerical study has been conducted on the thermal performance of a heat pipe cooling system considering several influential factors such as the coolant flow rate, the coolant inlet temperature, and the input power. A comparison between numerical data and results available in the literature has demonstrated that our numerical procedure could successfully predict the heat transfer performance of the considered heat pipe cooling system for a battery. Specific indicators such as temperature, heat flux, and pressure loss were extracted to describe the characteristics of such a system. On the basis of the distributions of the temperature ratio of… More >

  • Open Access


    Experimental Study on the Thermal Performance of a PCM Panel with Mach-Zehnder Interferometry

    Fabio Almeida1,*, Wey H. Leong2, Alan S. Fung2

    The International Conference on Computational & Experimental Engineering and Sciences, Vol.21, No.1, pp. 20-20, 2019, DOI:10.32604/icces.2019.05573

    Abstract An experimental study was performed to measure the convective heat transfer and thermal decay of a vertical PCM (Phase Change Material) panel. The PCM (soy wax) was enclosed in a thin acrylic shell with an insulated perimeter. The panel was heated to 70°C and allowed to cool by natural convection to room temperature. The experiment captured the transient thermal behaviour of the panel in free convection during liquid and solid phases, and during phase change. Near temperature field visualization and convective heat transfer measurements were obtained using Mach Zehnder Interferometry at one-minute intervals. Finite fringe interferograms were used to obtain… More >

  • Open Access


    Analysis on the Thermal Performance of Nanofluids As Working Fluid With Porous Heat Sinks: Applications in Electronics Cooling

    Ziad Saghir, Cayley Delisle, Christopher Welsford*

    The International Conference on Computational & Experimental Engineering and Sciences, Vol.21, No.1, pp. 19-19, 2019, DOI:10.32604/icces.2019.05145

    Abstract The enhancement of consumer and industrial electronics has led to an increase in both the power and compactness of the products available. However, with these increases follows a subsequent increase in the thermal losses experienced across, for example, a central processing unit (CPU). As well, the need to dissipate waste thermal energy is compounded by the increased compactness. As the chipsets become smaller, the threads contained therein also reduce in size and as such become more sensitive to temperature gradients which can cause deformation. Although this deformation is miniscule, its continuous repetition can ultimately result in a thermally induced fatigue… More >

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