Adnan¹, Umar Khan², Naveed Ahmed³, Syed Tauseef Mohyud-Din⁴, Ilyas Khan^5,*, Dumitru Baleanu^6,7,8, Kottakkaran Sooppy Nisar⁹

CMC-Computers, Materials & Continua, Vol.66, No.2, pp. 1563-1576, 2021, DOI:10.32604/cmc.2020.012326

Abstract Thermal transport investigation in colloidal suspensions is taking a significant research direction. The applications of these fluids are found in various industries, engineering, aerodynamics, mechanical engineering and medical sciences etc. A huge amount of thermal transport is essential in the operation of various industrial production processes. It is a fact that conventional liquids have lower thermal transport characteristics as compared to colloidal suspensions. The colloidal suspensions have high thermal performance due to the thermophysical attributes of the nanoparticles and the host liquid. Therefore, researchers focused on the analysis of the heat transport in nanofluids under… More >

L. Krambeck¹, G. A. Bartmeyer¹, D. O. Souza², D. Fusão¹, P. H. D. Santos², T. Antonini Alves^1,*

Energy Engineering, Vol.118, No.1, pp. 1-14, 2021, DOI:10.32604/EE.2020.013572

Abstract The temperature control in electronic packaging is the key in numerous applications, to avoid overheating and hardware failure. Due to high capability of heat transfer, good temperature uniformity, and no power consumption, heat pipes can be widely used for heat dissipation of electronic components. This paper reports an experimental thermal analysis of different capillary structures for heat pipes. The wicks considered are metal screens, axial microgrooves, and sintered metal powder. The heat pipes are made of copper, a 200 mm length tube and a 9.45 mm external diameter. Working fluid used was distilled water. The… More >

Basharat Ullah¹, Umar Khan¹, Hafiz Abdul Wahab¹, Ilyas Khan^2,*, Dumitru Baleanu^3,4,5, Kottakkaran Sooppy Nisar⁶

CMC-Computers, Materials & Continua, Vol.66, No.1, pp. 947-960, 2021, DOI:10.32604/cmc.2020.012430

Abstract The investigation of Thermal performance in nanofluids and hybrid nanofluids over a curved stretching infinite region strengthens its roots in engineering and industry. Therefore, the comparative thermal analysis in SiO₂–H₂O and (MoS₂–SiO₂)–H₂O is conducted over curved stretching surface. The model is reduced in the dimensional version via similarity transformation and then treated numerically. The velocity and thermal behavior for both the fluids is decorated against the preeminent parameters. From the analysis, it is examined that the motion of under consideration fluids declines against Fr and λ. The thermal performance enhances for higher volumetric fraction and λ. More >

Asaad H. Sayer¹, Hameed B. Mahood^2,*

Energy Engineering, Vol.117, No.6, pp. 367-379, 2020, DOI:10.32604/EE.2020.011156

Abstract Salinity gradient solar ponds (SGSPs) provide a tremendous way to collect and store solar radiation as thermal energy, and can help meet the critical need for sustainable ways of producing fresh water. However, surface evaporation results in the loss of both water and heat. This study therefore theoretically investigates the effect on temperatures within an SGSP when its surface is covered with a layer of air encased in a nylon bag. An earlier SGSP model was slightly modified to add the air layer and to estimate the temperature distributions of the upper layer or the… More >

Bengang Zhang^1,2,#, Xuedong Xi^3,#, Zhigang Wu^1,*, Hong Lei^2,*, Lifen Li¹, Meifen Tian¹

Journal of Renewable Materials, Vol.8, No.11, pp. 1429-1441, 2020, DOI:10.32604/jrm.2020.011985

Abstract According to the preparation method commonly used for soy proteinbased adhesives, alfalfa leaf protein was used as the raw material to prepare alfalfa leaf protein-based wood adhesive. Differential scanning calorimetry analyzer (DSC), X-ray diffraction (XRD) and Fourier transform infrared spectroscopy (FTIR) were used to characterize properties of the alfalfa leaf protein-based adhesive in this paper. The results revealed the following: (1) Chemical compositions and chemical structures of the alfalfa leaf protein were basically identical with those of the soy protein, both belonging to spherical proteins with the basis and potential for protein adhesives preparation, and… More >

Lingtong Li¹, Zaiguo Fu^{1, *}, Benxiang Li², Qunzhi Zhu¹

CMES-Computer Modeling in Engineering & Sciences, Vol.124, No.1, pp. 23-44, 2020, DOI:10.32604/cmes.2020.09299

Abstract The earth to fluid pipe (ETFP) system has been widely applied to various energy engineering. The numerical model of the heat transfer process in the ETFP system with a shallow-buried horizontal or a deep-buried vertical U-shape pipe adopted in practical engineering was established and the model distinctions were pointed out. The comparison of the thermal performance between the two types of ETFP system under various schemes was conducted on the basis of numerical prediction. The results showed that the thermal parameters of the ETFP system with a shallow-buried horizontal pipe were influenced by the inlet… More >

M. Čekon^*, K. Struhala, R. Slávik

Journal of Renewable Materials, Vol.5, Suppl.1, pp. 84-93, 2017, DOI:10.7569/JRM.2017.634135

Abstract Cardboard-based packaging components represent a material that has significant potential as a renewable source for exploitation in buildings. This study presents the results of thermal and environmental analyses of existing packaging materials compared with standard conventional thermal insulations.
Experimental measurements were performed to identify the thermal performance of studied cardboard packaging materials. Real-size samples were experimentally tested in laboratory measurements. The thermal resistance and conductivity of all the analyzed samples were measured according to the procedure indicated in the ISO8032 standard. A life-cycle assessment according to ISO 14040 was also performed to evaluate the environmental More >

Chaoyi Wan^{1, *}

FDMP-Fluid Dynamics & Materials Processing, Vol.15, No.4, pp. 343-356, 2019, DOI:10.32604/fdmp.2019.07812

Abstract A comparative numerical study has been conducted on the thermal performance of a heat pipe cooling system considering several influential factors such as the coolant flow rate, the coolant inlet temperature, and the input power. A comparison between numerical data and results available in the literature has demonstrated that our numerical procedure could successfully predict the heat transfer performance of the considered heat pipe cooling system for a battery. Specific indicators such as temperature, heat flux, and pressure loss were extracted to describe the characteristics of such a system. On the basis of the distributions More >

Fabio Almeida^1,*, Wey H. Leong², Alan S. Fung²

The International Conference on Computational & Experimental Engineering and Sciences, Vol.21, No.1, pp. 20-20, 2019, DOI:10.32604/icces.2019.05573

Abstract An experimental study was performed to measure the convective heat transfer and thermal decay of a vertical PCM (Phase Change Material) panel. The PCM (soy wax) was enclosed in a thin acrylic shell with an insulated perimeter. The panel was heated to 70°C and allowed to cool by natural convection to room temperature. The experiment captured the transient thermal behaviour of the panel in free convection during liquid and solid phases, and during phase change. Near temperature field visualization and convective heat transfer measurements were obtained using Mach Zehnder Interferometry at one-minute intervals. Finite fringe… More >

Ziad Saghir, Cayley Delisle, Christopher Welsford^*

The International Conference on Computational & Experimental Engineering and Sciences, Vol.21, No.1, pp. 19-19, 2019, DOI:10.32604/icces.2019.05145

Abstract The enhancement of consumer and industrial electronics has led to an increase in both the power and compactness of the products available. However, with these increases follows a subsequent increase in the thermal losses experienced across, for example, a central processing unit (CPU). As well, the need to dissipate waste thermal energy is compounded by the increased compactness. As the chipsets become smaller, the threads contained therein also reduce in size and as such become more sensitive to temperature gradients which can cause deformation. Although this deformation is miniscule, its continuous repetition can ultimately result… More >