F.Z. Ferahta^1,2, S. Bougoul¹, M. Médale², C. Abid²

FDMP-Fluid Dynamics & Materials Processing, Vol.8, No.3, pp. 339-352, 2012, DOI:10.3970/fdmp.2012.008.339

Abstract A numerical study is carried out to evaluate the thermal performances of a solar collector. As it is well known, that the thermal losses of such systems are mainly of a convective nature, the study is concentrated in particular on the features of natural convection that is activated in the air domain delimited by the upper glass and the lower absorber of the solar collector. The efficiency of such a system depends essentially on both the temperature difference and the distance between the absorber and the glass. Since the temperature difference remains an uncontrolled variable (because it depends on the… More >

Y. T. Wu¹, J. Z. Cui², Y. F. Nie³, Y. Zhang³

CMC-Computers, Materials & Continua, Vol.42, No.3, pp. 205-226, 2014, DOI:10.3970/cmc.2014.042.205

Abstract Core–shell particle–filled PA6/EPDM–g–MA/HDPE ternary blend has excellent mechanical properties. In this paper, effective elastic properties and tensile yield strength of the ternary blend are predicted by the second–order two– scale method, to investigate the relationship between morphology and mechanical properties. The method and the limit analysis for predicting mechanical properties of random heterogeneous materials are briefly introduced. Realistic morphology of the ternary blend including both core–shell particles and pure particles is simulated, and finite element mesh is generated. The unified strength theory is embedded in the method for the convenience of selecting a suitable yield criterion. The effective elastic moduli… More >

Sanjeev Saxena¹, Raghvendra Singh², Geeta Agnihotri²

CMC-Computers, Materials & Continua, Vol.36, No.3, pp. 257-270, 2013, DOI:10.3970/cmc.2013.036.257

Abstract The present numerical study is an attempt to understand the dependency of characteristic distance on the fracture specimen thickness and temperature. The presented work will be useful to establish the characteristic distance prediction methodology using three dimensional FEM model. Based on the methods proposed for the numerical prediction of characteristic distance, it comes out that it depends on fracture specimen thickness and finally it converges after a specified thickness of fracture specimen. In Armco iron material, characteristic distance varies in temperature ranges where dynamic strain ageing phenomenon is observed, initially decrease and then increases again. More >

Syh-Tsang Jenq^1,2, Yuen-Sheng Chiu²

CMC-Computers, Materials & Continua, Vol.11, No.1, pp. 33-58, 2009, DOI:10.3970/cmc.2009.011.033

Abstract Current work studies the transient hydroplaning behavior of 200 kPa inflated pneumatic radial tires with various types of tread patterns. Tires were numerically loaded with a quarter car weight of 4 kN, and then accelerated from rest rolling over a water film with a thickness of 5, 10 and 15 mm on top of a flat pavement. Tire structure is composed of outer rubber tread and inner fiber reinforcing composite layers. The Mooney-Rivlin constitutive law and the classical laminated theory (CLT) were, respectively, used to describe the mechanical behavior of rubber material and composite reinforcing layers. The tire hydroplaning phenomenon… More >

Heng-Cheng Lin¹, Chieh Kung², Rong-Sheng Chen¹, Gin-Tiao Liang¹

CMC-Computers, Materials & Continua, Vol.3, No.2, pp. 55-64, 2006, DOI:10.3970/cmc.2006.003.055

Abstract Wafer level chip scale package (WLCSP) has been recognized providing clear advantages over traditional wire-bond package in relaxing the need of underfill while offering high density of I/O interconnects. Without the underfill, the solder joint reliability becomes more critical. Adding to the reliability concerns is the safety demand trend toward "green'' products on which unleaded material, e.g. lead-free solders, is required. The requirement of lead-free solders on the packages results in a higher reflow temperature profile in the package manufacturing process, in turn, complicating the reliability issue. This paper presents an optimization study, considering the fatigue reliability, for a wafer… More >