Shuling Hu¹, Shengping Shen^1,2

CMES-Computer Modeling in Engineering & Sciences, Vol.30, No.2, pp. 57-64, 2008, DOI:10.3970/cmes.2008.030.057

Abstract The effects of surface energy on the interaction between two voids of equal size are investigated. The problem is solved by series expansion in bipolar coordinates. The results show that the surface energy significantly affects the stress concentration around the holes as the size of the holes shrinks to nanometers, meanwhile the interaction between the holes also influences the stress distribution around the holes, which become evident as the holes close to each other. This problem is of great importance in engineering applications. More >

Walter Gerstle¹, Stewart Silling², David Read³, Vinod Tewary⁴, Richard Lehoucq⁵

CMC-Computers, Materials & Continua, Vol.8, No.2, pp. 75-92, 2008, DOI:10.3970/cmc.2008.008.075

Abstract A theoretical framework, based upon the peridynamic model, is presented for analytical and computational simulation of electromigration. The framework allows four coupled physical processes to be modeled simultaneously: mechanical deformation, heat transfer, electrical potential distribution, and vacancy diffusion. The dynamics of void and crack formation, and hillock and whisker growth can potentially be modeled. The framework can potentially be applied at several modeling scales: atomistic, crystallite, multiple crystallite, and macro. The conceptual simplicity of the model promises to permit many phenomena observed in microchips, including electromigration, thermo-mechanical crack formation, and fatigue crack formation, to be analyzed in a systematic and… More >

M. Marin^1,2, A.M. Abd-Alla^3,4, D. Raducanu¹, S.M. Abo-Dahab^3,5

CMC-Computers, Materials & Continua, Vol.45, No.2, pp. 107-126, 2015, DOI:10.3970/cmc.2015.045.107

Abstract Our study is dedicated to mixed initial boundary value problem for porous micropolar bodies. We prove that the solution of this problem depends continuously on coefficients which couple the micropolar deformation equations with the equations that model the evolution of voids. The evaluation of this dependence is made by using an appropriate measure. More >

Marin Marin¹, Ravi P. Agarwal², Mohamed Othman³

CMC-Computers, Materials & Continua, Vol.40, No.1, pp. 35-48, 2014, DOI:10.3970/cmc.2014.040.035

Abstract In this study we want to decide whether the decay of the solutions of the mixed initial boundary value problem in the context of thermoelasticiy of micropolar bodies with voids is sufficiently fast to guarantee that they vanish after a finite time. In fact, we prove that the effect of the micropolar structure in combination with the thermal and porous dissipation can not determine the thermomechanical deformations vanish after a finite time. More >

R. R. Valisetty¹, A.M. Dongare², A.M. Rajendran³, R. R. Namburu¹

CMC-Computers, Materials & Continua, Vol.36, No.3, pp. 231-255, 2013, DOI:10.3970/cmc.2013.036.231

Abstract Materials used in soldier protective structures, such as armor, vehicles and civil infrastructures, are being improved for performance in extreme dynamic environments. Nanocrystalline metals show significant promise in the design of these structures with superior strengths attributed to the dislocation-based and grain-boundary-based processes as compared to their polycrystalline counterparts. An optimization of these materials, however, requires a fundamental understanding of damage evolution at the atomic level. Accordingly, atomistic molecular dynamics simulations are performed using an embedded-atom method (EAM) potential on three nano-crystalline aluminum atom systems, one a Voronoi-based nano-crystalline system with an average grain size of 10 nm, and the… More >

A. M. Dongare^1,2, A. M. Rajendran³, B. LaMattina⁴, M. A. Zikry¹, D. W. Brenner¹

CMC-Computers, Materials & Continua, Vol.24, No.1, pp. 43-60, 2011, DOI:10.3970/cmc.2011.024.043

Abstract Large-scale molecular dynamics (MD) simulations are used to investigate the effects of microstructure and loading conditions on the dynamic failure behavior of nanocrystalline Cu. The nucleation, growth, and coalescence of voids is investigated for the nanocrystalline metal with average grain sizes ranging from 6 nm to 12 nm (inverse Hall-Petch regime) for conditions of uniaxial expansion at constant strain rates ranging from 4x107 s - 1 to 1010 s - 1. MD simulations suggest that the evolution of voids can be described in two stages: The first stage corresponds to the nucleation of voids and the fast linear initial growth… More >