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Magnetic Field Effect and Heat Transfer of Nanofluids within Waveform Microchannel

Mehdi Moslemi1, Motahare Mahmoodnezhad1, S. A. Edalatpanah1,*, Sulima Ahmed Mohammed Zubair2, Hamiden Abd El-Wahed Khalifa2,3

1 Ayandegan Institute of Higher Education, Tonekabon, Iran
2 Department of Mathematics, College of Science and Arts, Qassim University, Ar Rass, Saudi Arabia
3 Operations Research Department, Faculty of Graduate Studies for Statistical Research, Cairo University, Giza, Egypt

* Corresponding Authors: S. A. Edalatpanah. Email: ,

(This article belongs to this Special Issue: Numerical Methods in Engineering Analysis, Data Analysis and Artificial Intelligence)

Computer Modeling in Engineering & Sciences 2023, 134(3), 1957-1973.


In this research, a numerical study of mixed convection of non-Newtonian fluid and magnetic field effect along a vertical wavy surface was investigated. A simple coordinate transformation to transform wavy surface to a flat surface is employed. A cubic spline collocation numerical method is employed to analyze transformed equations. The effect of various parameters such as Reynolds number, volume fraction 0-, Hartmann number, and amplitude of wave length was evaluated in improving the performance of a wavy microchannel. According to the presented results, the sinusoidal shape of the microchannel has a direct impact on heat transfer. By increasing the microchannel wave amplitude, the Nusselt number has risen. On the other hand, increasing the heat transfer in the higher wavelength ratio corrugated channel is seen as an effective method of increasing the heat transfer, especially at higher Reynolds numbers. The results showed that with increasing Hartmann numbers, the flow line near the wall becomes more regular and, according to the temperature gradient created, the Nusselt number growth.


Cite This Article

Moslemi, M., Mahmoodnezhad, M., Edalatpanah, S. A., Ahmed, S., Abd, H. (2023). Magnetic Field Effect and Heat Transfer of Nanofluids within Waveform Microchannel. CMES-Computer Modeling in Engineering & Sciences, 134(3), 1957–1973.

This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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