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Ashit Kumar Dutta1, S. Srinivasan2, S. N. Kumar3, T. S. Balaji4,5, Won Il Lee6, Gyanendra Prasad Joshi7, Sung Won Kim8,*
1 Department of Computer Science and Information Systems, College of Applied Sciences, AlMaarefa University, Ad Diriyah, Riyadh, 13713, Kingdom of Saudi Arabia
2 Institute of Biomedical Engineering, Saveetha School of Engineering, Saveetha Institute of Medical and Technical Sciences, Saveetha University, Saveetha Nagar, Thandalam, Chennai, 602105, India
3 Department of Electrical & Electronics Engineering, Amal Jyothi College of Engineering, Kanjirappally, Kerala, 686518, India
4 Saveetha School of Engineering, Saveetha Institute of Medical and Technical Sciences, Saveetha University, Saveetha Nagar, Thandalam, Chennai, 602105, India
5 Department of Electronics and Communication Engineering, College of Engineering and Technology, SRM Institute of Science and Technology, Vadapalani Campus, Chennai, 600026, India
6 Department of Business Administration, Hanbat National National University, Daejeon, 34158, Korea
7 Department of Computer Science and Engineering, Sejong University, Seoul, 05006, Korea
8 Department of Information and Communication Engineering, Yeungnam University, Gyeongsan-si, Gyeongbuk-do, 38541, Korea
* Corresponding Author: Sung Won Kim. Email:
Computers, Materials & Continua 2022, 72(3), 5563-5576. https://doi.org/10.32604/cmc.2022.027707
Received 24 January 2022; Accepted 08 March 2022; Issue published 21 April 2022
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