Open Access
ARTICLE
Shu-Yu Kuo1, Kuo-Chun Tseng2, Yao-Hsin Chou3, Fan-Hsun Tseng4,*
1 Department of Computer Science and Engineering, National Chung Hsing University, Taichung, 40227, Taiwan
2 Department of Physics, National Taiwan University, Taipei, 106216, Taiwan
3 Department of Computer Science and Information Engineering, National Chi Nan University, Puli, 54561, Taiwan
4 Department of Computer Science and Information Engineering, National Cheng Kung University, Tainan, 701401, Taiwan
* Corresponding Author: Fan-Hsun Tseng. Email:
Computers, Materials & Continua 2023, 74(1), 915-932. https://doi.org/10.32604/cmc.2023.032320
Received 13 May 2022; Accepted 24 June 2022; Issue published 22 September 2022
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