Open Access
REVIEW
Active Cooling Technologies for Hypersonic Vehicles: Challenges, Advances, and Future Prospects
1 College of Mechanical Engineering, Hunan University of Arts and Science, Changde, China
2 Hunan Gaochuang Xiangyu Technology Co., Ltd., Changde, China
* Corresponding Author: Liang Yin. Email:
Fluid Dynamics & Materials Processing 2026, 22(9), 11 https://doi.org/10.32604/fdmp.2026.085289
Received 08 May 2026; Accepted 08 September 2026; Issue published 28 September 2026
Abstract
Hypersonic vehicles are subjected to extreme aerodynamic heating, making active cooling technologies a critical component of their thermal protection systems. This paper presents a comprehensive review of the fundamental principles, operating mechanisms, recent research developments, and key technical challenges associated with three major active cooling approaches: regenerative cooling, gas film cooling, and transpiration cooling. The review establishes a comparative framework to support the selection of cooling strategies according to specific mission requirements, while identifying current limitations and outlining priorities for future research. The analysis shows that regenerative cooling is well suited to long-duration missions owing to its high heat removal capability, although it requires complex structural integration. Gas film cooling offers a relatively simple and effective solution but demands a substantial coolant supply, which can reduce overall system efficiency. Transpiration cooling exhibits significant potential for next-generation hypersonic vehicles because of its exceptional thermal protection performance, yet its implementation remains constrained by demanding material and manufacturing requirements. Future advances are expected to arise from hybrid cooling architectures that combine the strengths of multiple techniques, together with intelligent thermal management systems capable of adapting to highly variable operating conditions.Keywords
Cite This Article
Copyright © 2026 The Author(s). Published by Tech Science Press.This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


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