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Modeling of Dendritic Growth in Alloy Solidification with Melt Convection

C.P. Hong1, M.F. Zhu2, S.Y. Lee1

Dept. of Metallurgical Eng.,Yonsei University, Seoul, Korea, e-mail: hong@yonsei.ac.kr
Dept. of Materials Science and Eng., Southeast University, Nanjing, China.

Fluid Dynamics & Materials Processing 2006, 2(4), 247-260. https://doi.org/10.3970/fdmp.2006.002.247

Abstract

In typical solidification processes the flow of molten metal is usually regarded as an unavoidable phenomenon potentially affecting the morphology of dendritic growth. Fundamental understanding of such flow is thus important for predicting and controlling solidification microstructures. This paper presents numerical simulations on the evolution of dendritic microstructures with melt convection. A two-dimensional modified cellular automaton (MCA) coupled with a transport model is developed to simulate solidification of binary and ternary alloys in the presence of fluid flow. This model takes into account the effects of the constitutional undercooling and curvature undercooling on the equilibrium interface temperature. It also considers the preferred growth orientation of crystals and solute redistribution during solidification. The flow dynamics and mass transport both by convection and diffusion are numerically solved using a SIMPLE scheme. The physics of the complete time-dependent interaction among melt convection, mass transfer and dendritic growth is naturally included in the model.

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APA Style
Hong, C., Zhu, M., Lee, S. (2006). Modeling of dendritic growth in alloy solidification with melt convection. Fluid Dynamics & Materials Processing, 2(4), 247-260. https://doi.org/10.3970/fdmp.2006.002.247
Vancouver Style
Hong C, Zhu M, Lee S. Modeling of dendritic growth in alloy solidification with melt convection. Fluid Dyn Mater Proc. 2006;2(4):247-260 https://doi.org/10.3970/fdmp.2006.002.247
IEEE Style
C. Hong, M. Zhu, and S. Lee, “Modeling of Dendritic Growth in Alloy Solidification with Melt Convection,” Fluid Dyn. Mater. Proc., vol. 2, no. 4, pp. 247-260, 2006. https://doi.org/10.3970/fdmp.2006.002.247



cc Copyright © 2006 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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