Table of Content

Open Access iconOpen Access

ARTICLE

Three-Dimensional Numerical Simulation of Air Cooling of Electronic Components in a Vertical Channel

Y. Amirouche1, R. Bessaïh2

University of Jijel, Faculty of Science and Technology, Jijel, Algeria.
University of Mentouri-Constantine, Faculty of Engineering. Department of Mechanical Engineering, Constantine, Algeria.

Fluid Dynamics & Materials Processing 2012, 8(3), 295-310. https://doi.org/10.3970/fdmp.2012.008.295

Abstract

This paper summarizes a series of computational results originating from the simulation of three-dimensional turbulent natural convection occurring in a vertical channel containing 5 cubic aluminum heated sources (mimicking a set of electronics components equally spaced in the vertical direction). A three-dimensional, conjugate heat transfer model with appropriate boundary conditions is used. In particular, the governing equations are solved by a finite volume method throughout the entire physical domain. Calculations are made for distinct values of: the Rayleigh number, the ratio (air/solid) of thermal conductivities and other geometrical parameters (in order to examine the influence of such variables on the resulting heat transfer inside the channel).

Keywords


Cite This Article

Amirouche, Y., Bessaïh, R. (2012). Three-Dimensional Numerical Simulation of Air Cooling of Electronic Components in a Vertical Channel. FDMP-Fluid Dynamics & Materials Processing, 8(3), 295–310.



cc This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
  • 1532

    View

  • 1069

    Download

  • 0

    Like

Share Link