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Three-Dimensional Numerical Simulation of Air Cooling of Electronic Components in a Vertical Channel

Y. Amirouche1, R. Bessaïh2

University of Jijel, Faculty of Science and Technology, Jijel, Algeria.
University of Mentouri-Constantine, Faculty of Engineering. Department of Mechanical Engineering, Constantine, Algeria.

Fluid Dynamics & Materials Processing 2012, 8(3), 295-310. https://doi.org/10.3970/fdmp.2012.008.295

Abstract

This paper summarizes a series of computational results originating from the simulation of three-dimensional turbulent natural convection occurring in a vertical channel containing 5 cubic aluminum heated sources (mimicking a set of electronics components equally spaced in the vertical direction). A three-dimensional, conjugate heat transfer model with appropriate boundary conditions is used. In particular, the governing equations are solved by a finite volume method throughout the entire physical domain. Calculations are made for distinct values of: the Rayleigh number, the ratio (air/solid) of thermal conductivities and other geometrical parameters (in order to examine the influence of such variables on the resulting heat transfer inside the channel).

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APA Style
Amirouche, Y., Bessaïh, R. (2012). Three-dimensional numerical simulation of air cooling of electronic components in a vertical channel. Fluid Dynamics & Materials Processing, 8(3), 295-310. https://doi.org/10.3970/fdmp.2012.008.295
Vancouver Style
Amirouche Y, Bessaïh R. Three-dimensional numerical simulation of air cooling of electronic components in a vertical channel. Fluid Dyn Mater Proc. 2012;8(3):295-310 https://doi.org/10.3970/fdmp.2012.008.295
IEEE Style
Y. Amirouche and R. Bessaïh, "Three-Dimensional Numerical Simulation of Air Cooling of Electronic Components in a Vertical Channel," Fluid Dyn. Mater. Proc., vol. 8, no. 3, pp. 295-310. 2012. https://doi.org/10.3970/fdmp.2012.008.295



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