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Effects of Cold Plasma on Surface, Thermal and Antimicrobial Release Properties of Chitosan Film

S.K. Pankaj1, C. Bueno-Ferrer1, N.N. Misra1, L. O’Neill2, Paula Bourke1, P.J. Cullen3*

BioPlasma Research Group, School of Food Science and Environmental Health, Dublin Institute of Technology, Cathal Brugha Street, Dublin 1, Ireland
FOCAS Research Institute/School of Physics, Dublin Institute of Technology, Kevin Street, Dublin 8, Ireland
School of Chemical Engineering, UNSW, Sydney, Australia

*Corresponding author: email

Journal of Renewable Materials 2017, 5(1), 14-20. https://doi.org/10.7569/JRM.2016.634105

Abstract

This work aims to analyze the effects of cold atmospheric air plasma treatment of antimicrobial chitosan film with different levels of thymol. Optical characterization of the dielectric barrier discharge showed the generation of reactive nitrogen and oxygen species by the system. A significant increase (p < 0.05) in the surface roughness was observed after cold plasma treatment of the films. No significant difference (p > 0.05) was observed in the thermal profile of the plasma-treated films. A significant increase (p < 0.05) in the thymol diffusion coefficient was observed after the plasma treatment for all the active films.

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APA Style
Pankaj, S., Bueno-Ferrer, C., Misra, N., O’Neill, L., Bourke, P. et al. (2017). Effects of cold plasma on surface, thermal and antimicrobial release properties of chitosan film. Journal of Renewable Materials, 5(1), 14-20. https://doi.org/10.7569/JRM.2016.634105
Vancouver Style
Pankaj S, Bueno-Ferrer C, Misra N, O’Neill L, Bourke P, Cullen P. Effects of cold plasma on surface, thermal and antimicrobial release properties of chitosan film. J Renew Mater. 2017;5(1):14-20 https://doi.org/10.7569/JRM.2016.634105
IEEE Style
S. Pankaj, C. Bueno-Ferrer, N. Misra, L. O’Neill, P. Bourke, and P. Cullen, “Effects of Cold Plasma on Surface, Thermal and Antimicrobial Release Properties of Chitosan Film,” J. Renew. Mater., vol. 5, no. 1, pp. 14-20, 2017. https://doi.org/10.7569/JRM.2016.634105



cc Copyright © 2017 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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