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Preparation and Electrorheological Response of PAL/TiO2/PANI Nanorods

Ling Wang1,2, Chenchen Huang1, Ping Zhang3, Fenghua Liu1,*, Ting Zou1, Zhixiang Li1, Jianfei Zhang1, Gaojie Xu1

1 Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Science, Ningbo, 315201, China
2 Faculty of Materials Metallurgy and Chemistry, Jiangxi University of Science and Technology, Ganzhou, 341000, China
3 Xuyi County Attapulgite Application Technology R&D and Achievement Transformation Center, Xuyi, 211700, China

* Corresponding Author: Fenghua Liu. Email: email

(This article belongs to the Special Issue: Current Advances in Green Nanomaterials Applications)

Journal of Renewable Materials 2021, 9(10), 1707-1715. https://doi.org/10.32604/jrm.2021.013884

Abstract

Using palygorskite (PAL) as template, the PAL/TiO2/PANI nano-rods were synthesized by heterogeneous precipitation and in-situ polymerization. The synthesized PAL/TiO2/PANI nanorods were used as a novel electrorheological (ER) fluid by mixing with silicone oil, which showed excellent ER effect. The yield stress of the PAL/TiO2/PANI based ER fluid (15 vol%) reached 8.8 kPa under 4 kV mm−1 electric field. The dynamic shear stress of the PAL/TiO2/PANI based ER fluid could maintain a stable level in the shear rate range of 0.1–100 s−1 . Furthermore, the PAL/TiO2/PANI ER fluid exhibited excellent suspension stability.

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APA Style
Wang, L., Huang, C., Zhang, P., Liu, F., Zou, T. et al. (2021). Preparation and electrorheological response of pal/tio2/pani nanorods. Journal of Renewable Materials, 9(10), 1707-1715. https://doi.org/10.32604/jrm.2021.013884
Vancouver Style
Wang L, Huang C, Zhang P, Liu F, Zou T, Li Z, et al. Preparation and electrorheological response of pal/tio2/pani nanorods. J Renew Mater. 2021;9(10):1707-1715 https://doi.org/10.32604/jrm.2021.013884
IEEE Style
L. Wang et al., “Preparation and Electrorheological Response of PAL/TiO2/PANI Nanorods,” J. Renew. Mater., vol. 9, no. 10, pp. 1707-1715, 2021. https://doi.org/10.32604/jrm.2021.013884



cc Copyright © 2021 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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