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    PROCEEDINGS

    Peeling by Pulling: Characterizing the Mechanical Behavior of Nanoscale Thin Films

    Zhaohe Dai1,*

    The International Conference on Computational & Experimental Engineering and Sciences, Vol.26, No.2, pp. 1-1, 2023, DOI:10.32604/icces.2023.09223

    Abstract The flexible and clinging nature of ultra-thin films require the understanding of their elastic and adhesive properties in a wide range of circumstances from fabrications to applications. Simultaneously measuring both properties, however, is extremely difficult as the film thickness diminishes to nanoscales. In this talk, I will show our recent work that addresses such difficulties through peeling by vertically pulling thin films off from the substrates (we thus refer to it as “pull-to-peel”). Particularly, we perform in-situ pull-to-peel of graphene and MoS2 films in a scanning electron microscope and achieve simultaneous determination of their Young’s moduli and adhesions to gold… More >

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