Shankar Durgam
Frontiers in Heat and Mass Transfer, Vol.18, pp. 1-10, 2022, DOI:10.5098/hmt.18.49
Abstract This article explores experimentally and numerically the effect of conductance on cooling of electronic chips by forced air flow in a vertical channel
for thermal control. Experiments are conducted using substrates of FR4, bakelite, copper clad board (single layer) equipped with aluminum heat
sources at uniform heat fluxes of 1000, 2000, and 3000 W/m2
at 500 ≤ Re ≤ 1500. Computer simulations are performed to validate experimental
results using a finite element method based COMSOL Multiphysics 4.3b software and the results are in agreements of below 10%. The temperatures
obtained showed high thermal conductance copper clad boards (CCBs) are very… More >
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