Home / Advanced Search

  • Title/Keywords

  • Author/Affliations

  • Journal

  • Article Type

  • Start Year

  • End Year

Update SearchingClear
  • Articles
  • Online
Search Results (53)
  • Open Access


    First-principles Calculation of Interfacial Adhesion Strength and Electromigration for the Micro-bump Interconnect of 3D Chip Stacking Packaging

    W.H. Chen1, H.C. Cheng2,3, C.F. Yu1,3

    CMES-Computer Modeling in Engineering & Sciences, Vol.109-110, No.1, pp. 1-13, 2015, DOI:10.3970/cmes.2015.109.001

    Abstract This study aims at exploring the interfacial adhesion strength between solder bump and four typical under bump metallurgies (UBMs), i.e., Cu/Ni, Cu/TiW, Cu/Ni/Cr and /Cu/V/Cr, at atomistic scale. The average bond length and interfacial adhesion stress of the Sn-3.5Ag/Cu/Ni, Sn-3.5Ag/Cu/TiW, Sn-3.5Ag/Cu/Ni/Cr and Sn-3.5Ag/Cu/V/Cr micro-bump interconnects are calculated through the firstprinciples density functional theory (DFT) calculation to estimate the interfacial adhesion strength between the solder bump and UBMs. In addition, by investigating the electric field effect on the average bond length and adhesive stress, the combination of solder bump and UBM with better interfacial adhesion strength… More >

  • Open Access


    Molecular-Dynamics Analysis of Grain-Boundary Grooving in Interconnect Films with Underlayers

    T. Iwasaki1 and H. Miura1

    CMES-Computer Modeling in Engineering & Sciences, Vol.4, No.5, pp. 551-558, 2003, DOI:10.3970/cmes.2003.004.551

    Abstract We have developed a molecular-dynamics technique for investigating migration-induced failures in interconnect films for ULSIs. This technique was used to simulate grain-boundary grooving in Al and Cu films. The simulations showed that the grain-boundary grooves are formed by atomic diffusion at the grain boundary. To clarify what kind of underlay material is effective in suppressing this diffusion, we calculated the dependence of groove depth on the kind of underlay material. The calculation showed that the groove depth of the Al film decreases in the order: Al/Ta, Al/W, and Al/TiN while that of the Cu film More >

  • Open Access


    Mechanical Characterization of Viscoelastic-Plastic Soft Matter Using Spherical Indentation

    B Keerthika1, Y P Cao2, D Raabe1

    CMC-Computers, Materials & Continua, Vol.10, No.3, pp. 243-258, 2009, DOI:10.3970/cmc.2009.010.243

    Abstract In this study, effects of the plastic deformation and the time-dependent deformation behavior on the fundamental relations in the Oliver & Pharr method are studied by using finite element analysis based on a viscoelastic-plastic model developed for polymers. The study eventually yields an experimental protocol and using which, the instantaneous modulus of the viscoelastic-plastic materials may be reliably determined. Experiments have been performed on four polymers to verify the conclusions from the numerical analysis. More >

Displaying 51-60 on page 6 of 53. Per Page