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Molecular Dynamics Simulations of the Nanoindentation for Aluminum and Copper

Xiaozhi Tang¹, Yafang Guo¹, Yu Gao¹

CMC-Computers, Materials & Continua, Vol.23, No.1, pp. 1-8, 2011, DOI:10.3970/cmc.2011.023.001

Abstract Atomistic simulations were performed to study the nanoindentation for two kinds of FCC metals, aluminum and copper. Due to the higher stacking faults in aluminum than in copper, two different deformation mechanisms were observed in our simulation under exactly the same simulation condition. Aluminum and copper also showed different mechanical properties in the unloading stage. The influence of stacking sequence along the loading direction on deformation mechanism was also investigated in this paper. More >

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