Hsien-Chie Cheng1,2, Chien-Hao Ma1, Ching-Feng Yu3, Su-Tsai Lu4, Wen-Hwa Chen2,3
CMC-Computers, Materials & Continua, Vol.38, No.3, pp. 129-154, 2013, DOI:10.3970/cmc.2013.038.129
Abstract User experiences for electronic devices with high portability and flexibility, good intuitive human interfaces and low cost have driven the development of semiconductor technology toward flexible electronics and display. In this study proposes, an advanced flexible interconnect technology is proposed for flexible electronics, in which an ultra-thin IC chip having a great number of micro-bumps is bonded onto a very thin flex substrate using an epoxy-based anisotropic conductive film (ACF) to form fine-pitch and reliable interconnects or joints (herein termed ACF-typed thin-flip-chip-on-flex (TFCOF) technology). The electrical and thermal -mechanical performances of the micro-joints are the key to the feasibility and… More >
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