H. C. Cheng1, C. Y. Yu2, W. H. Chen3
CMES-Computer Modeling in Engineering & Sciences, Vol.7, No.1, pp. 1-18, 2005, DOI:10.3970/cmes.2005.007.001
Abstract In this study, a simple but effective solution methodology that integrates a modified global/local finite element (GLFE) modeling technique and a two-staged constitutive modeling strategy is presented for the thermal-mechanical modeling of solder joints in an area array typed electronic package for characterizing the associated solder joint fatigue life under the JEDEC temperature cycling specification. The effectiveness and applicability of the proposed technique are demonstrated through two case studies, each of which is associated with an area array typed test vehicle. The geometry profile of solder joints in the test vehicle is determined by the Surface Evolver [Brakke (1996)]. For… More >
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