Bin Xiao^*

Frontiers in Heat and Mass Transfer, Vol.22, No.1, pp. 35-48, 2024, DOI:10.32604/fhmt.2024.048039

Abstract Experiments were conducted in this study to examine the thermal performance of a thermosyphon, made from Inconel alloy 625, could recover waste heat from automobile exhaust using a limited amount of fluid. The thermosyphon has an outer diameter of 27 mm, a thickness of 2.6 mm, and an overall length of 483 mm. The study involved directing exhaust gas onto the evaporator. This length includes a 180-mm evaporator, a 70-mm adiabatic section, a 223-mm condenser, and a 97-mm finned exchanger. The study examined the thermal performance of the thermosyphon under exhaust flow rates ranging from 0–10 g/sec and temperatures varying… More >

Chen Gao¹, Kai Sun¹, QingZhi Hou^2,3, KeWei Song^1,2,*

The International Conference on Computational & Experimental Engineering and Sciences, Vol.27, No.4, pp. 1-3, 2023, DOI:10.32604/icces.2023.08905

Abstract As the fossil energy is increasingly exhausted and air pollution becomes more and more serious, blade electric vehicles equipped with rechargeable lithium-ion battery turns into the major developing direction of new energy automobile [1-3]. Lithium-ion batteries have the advantages of high energy density, light weight, and no pollution, and thereby are widely used in electric vehicles [4,5]. However, the working performance and service life of lithium-ion batteries are greatly affected by temperature [6]. Excessive high and low temperature will reduce the charge and discharge capacity of lithium-ion batteries, shorten their service life, and even lead to safety accidents [7]. Therefore,… More >

Amir Faghri, Yuwen Zhang

Frontiers in Heat and Mass Transfer, Vol.8, pp. 1-1, 2017, DOI:10.5098/hmt.8.41

Abstract This article has no abstract. More >

Masataka Mochizuki^a,*,†, Thang Nguyen^b

Frontiers in Heat and Mass Transfer, Vol.13, pp. 1-6, 2019, DOI:10.5098/hmt.13.12

Abstract The cooling device for computers and electronics is getting smaller and thinner year after year, especially for the mobile handheld device such as smartphone which is the most popular gadget and widely use nowadays. It seems that in the current trend every 6-12 months a new model of smartphone is introduced and it was packed with faster processing processor, memories, and graphics, higher density battery, higher resolution for camera and video and so on. The drawback is the device getting hotter due to the increase of heat dissipation caused by faster computing. The traditional method of cooling by purely metal… More >

B. Orr^a,* , R. Singh^a, A. Akbarzadeh^b , M. Mochizuki^c

Frontiers in Heat and Mass Transfer, Vol.13, pp. 1-7, 2019, DOI:10.5098/hmt.13.8

Abstract Heat pipes that operate in the medium temperature range (550-700 K) are very rarely used in industry despite the potential demand of use. There is no consensus about suitable working fluids in this temperature range as research on possible working fluids is limited. One proposed working fluid is naphthalene. In this paper, a number of tests have been undertaken on both an individual naphthalene heat pipe and a naphthalene heat pipe heat exchanger. Unlike room temperature working fluids, medium temperature working fluids are solid at ambient temperature therefore they have unusual transient start up behaviour. Testing has indicated that these… More >

C. B. Sobhan^aG. P. Peterson^b,*

Frontiers in Heat and Mass Transfer, Vol.13, pp. 1-10, 2019, DOI:10.5098/hmt.13.5

Abstract Micro heat pipes have found applications in numerous types of systems where effective heat dissipation in a limited space is required. One relatively new design/fabrication methodology for parallel micro heat pipes with high performance is referred to as “wire-bonded” micro heat pipe arrays. The following review analyzes the principles of operation of these devices and investigates the recent developments in the technology, along with their fabrication and application. The results indicate that these micro heat pipe arrays present an attractive alternative for a number of interesting applications, including many that have yet to be explored.   More >

Randeep Singh^a,*,†, Gero Lapp^a, Jason Velardo^b, Phan Thanh Long^a, Masataka Mochizuki^c, Aliakbar Akbarzadeh^d, Abhijit Date^d, Karsten Mausolf^e, Kristin Busse^e

Frontiers in Heat and Mass Transfer, Vol.16, pp. 1-8, 2021, DOI:10.5098/hmt.16.2

Abstract In this paper, different options, based on heat pipes, for thermal management of electric vehicle (EV) battery system, at cell, module and pack level, for 40 to 400 W output heat, has been explored, analysed and compared. Cooling architecture based on embedded heat pipe (EHP) with single phase pumped cold plate (CP), as most adaptable design for low to medium range EVs, while EHP with loop heat pipe (LHP) as high performance design for high-end carlines, has been classified as potential cooling systems. Experimentally, it was shown that EHPs will provide best performance for heat acquisition at cell/module level, while… More >

Jason Velardo^a, Randeep Singh^a,*, Mohammad Shahed Ahamed^a, Masataka Mochizuki^b, Abhijit Date^c, Aliakbar Akbarzadeh^c

Frontiers in Heat and Mass Transfer, Vol.17, pp. 1-11, 2021, DOI:10.5098/hmt.17.1

Abstract Thermal solutions play an integral role in managing heat loads for electronic devices. As these electronics become more compact and portable, improved thermal management solutions need to be introduced. Thin flattened heat pipes (0.8mm – 2.0mm thick) and piezoelectric fans (1mm thick) have been proposed here for this purpose. The maximum heat carrying capacity of the flattened heat pipe was experimentally determined and found to be a function of the flattened heat pipe thickness. Reductions from 48W at 2.0mm to 7W at 0.8mm were observed. This was expected to be due to capillary limitations. The piezoelectric fan could be operated… More >

Yu.E. Nikolaenko^a , D.V. Pekur^b,*, V.Yu. Кravets^a, V.M. Sorokin^b, D.V. Kozaka , R.S. Melnyk^a, L.V. Lipnitskyi^a, A.S. Solomakha^a

Frontiers in Heat and Mass Transfer, Vol.18, pp. 1-13, 2022, DOI:10.5098/hmt.18.23

Abstract This study compares thermal characteristics of two design versions of a new low-cost air-cooling system with a standard heat sink profile and built-in flat heat pipes of a simple design with a similar cooling system design without the heat pipes. The aim of the work is to determining the thermal characteristics and choosing the most effective option in a practical context. Using computer simulation in the Solidworks Flow Simulation standard software package allowed determining how the temperature of 8 transistors with a total power of 224 W was affected by changes in air velocity from 1 to 30 m/s, effective… More >

L. Krambeck¹, G. A. Bartmeyer¹, D. O. Souza², D. Fusão¹, P. H. D. Santos², T. Antonini Alves^1,*

Energy Engineering, Vol.118, No.1, pp. 1-14, 2021, DOI:10.32604/EE.2020.013572

Abstract The temperature control in electronic packaging is the key in numerous applications, to avoid overheating and hardware failure. Due to high capability of heat transfer, good temperature uniformity, and no power consumption, heat pipes can be widely used for heat dissipation of electronic components. This paper reports an experimental thermal analysis of different capillary structures for heat pipes. The wicks considered are metal screens, axial microgrooves, and sintered metal powder. The heat pipes are made of copper, a 200 mm length tube and a 9.45 mm external diameter. Working fluid used was distilled water. The devices are investigated in three… More >