D.S.Liu1, C.L.Hsu1,2
CMC-Computers, Materials & Continua, Vol.40, No.3, pp. 165-178, 2014, DOI:10.3970/cmc.2014.040.165
Abstract To ensure the reliability of microelectronics packages, the high strain rate deformation behavior of the solder joints must be properly understood. Accordingly, the present study proposes a hybrid experimental / numerical method for determining the optimal constants of the Johnson-Cook (J-C) constitutive model for 96.5Sn-3Ag-0.5Cu (SAC305) solder alloy. In the proposed approach, FEM simulations based on the J-C model are performed to describe the load-time response of an SAC305 ball solder joint under an impact velocity of 0.5 m/s. The optimal values of the constitutive model are then determined using an iterative Genetic Algorithm approach based on a comparison of… More >
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